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FLIP CHIP BONDING
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FLIP CHIP BONDING

  • Bonding accuracy : 1.5 um (Typ. <1.0 um)
  • Available for multi-channel bonding by using discrete chip
  • Available for custom made of submount (SiOB, Glass and AlN etc.)
미래텍
대전광역시 유성구 테크노3로 65, B118호 (관평동, 한신에스메카)
126-62-00260
조무희
042-862-9993
010-4471-6730
042-935-3999