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PACKAGE ASSEMBLY
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PACKAGE ASSEMBLY

Optical module packaging
  • Si Photonics
  • Optical sensor modules
  • COB types
RF module packaging
  • COB types
  • QFN packages
  • Customer package types
Optical coupling
  • Optical fiber array to waveguide
  • LD - Lens - Optical fiber
Epoxy/Eutectic bonding
  • Material :

    Conductive epoxy, Non conductive epoxy,

    Sintering paste, Eutectic Au/Sn

  • Precision die attach :

    Min. die size : 0.2mm square

    Rotation accuracy : <+/- 1 degree

    Position accuracy : <+/- 10 um

Light source packaging
  • Bulb types (Parabolic reflector)
  • TO types
  • Mini-dil types
  • Butterfly types
  • Micro optics components
미래텍
대전광역시 유성구 테크노3로 65, B118호 (관평동, 한신에스메카)
126-62-00260
조무희
042-862-9993
010-4471-6730
042-935-3999