Wire Bonding

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Wire Bonding

이름 : waseem muhammad
연락처 : 01031041051
이메일 : 2027@teltron.com
Hi,
My name is Waseem, Manager research lab Teltron Inc. We are looking forward your kind response to proceed with Wire bonding for Chip on Board. I have attached the PPT file for your review please.
Looking forward your quick response for further communication.

Please feel free to contact me at EMail: 2027@teltron.com or 010-3104-1051.

Thank you.

Regards
Waseem
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